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IISER-KIndian Institute of Science Education & Research - Kolkata
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You searched IISERK - Title: Tale of two species
Tag In 1 In 2 Data
001  vtls000012861
003  IISER-K
005  20140514151100.0
006  m d
007  cr cn|||||||||
008  090617s1998 caua sb 001 0 eng d
020  \a 9780125249850
020  \a 0125249853
037  \a 75946:75946 \b Elsevier Science & Technology \n http://www.sciencedirect.com
039 9\a 201405141511 \b VLOAD \y 200906171909 \z VLOAD
049  \a TEFA
08204\a 621.381 \2 22
1001 \a Ohring, Milton, \d 1936-
24510\a Reliability and failure of electronic materials and devices \h [electronic resource] / \c Milton Ohring.
24630\a Electronic materials and devices
260  \a San Diego : \b Academic Press, \c c1998.
300  \a xxi, 692 p. : \b ill. ; \c 24 cm.
504  \a Includes bibliographical references and index.
5050 \a An Overview of Electronic Devices and Their Reliability. Electronic Devices: How They Operate and Are Fabricated. Defects, Contaminants, and Yield. The Mathematics of Failure and Reliability. Mass Transport-Induced Failure. Electronic Charge-Induced Damage. Environmental Damage to Electronic Products. Packaging Materials, Processes and Stresses. Degradation of Contacts and Package Interconnections. Degradation and Failure of Electro-Optical Materials and Devices. Characterization and Failure Analysis of Materials and Devices. Future Directions and Reliability Issues.
520  \a Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. Key Features * Discusses reliability and failure on both the chip and packaging levels * Handles the role of defects in yield and reliability * Includes a tutorial chapter on the mathematics of reliability * Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints * Considers defect detection methods and failure analysis techniques.
533  \a Electronic reproduction. \b Amsterdam : \c Elsevier Science & Technology, \d 2007. \n Mode of access: World Wide Web. \n System requirements: Web browser. \n Title from title screen (viewed on July 25, 2007). \n Access may be restricted to users at subscribing institutions.
650 0\a Electronic apparatus and appliances \x Reliability.
650 0\a System failures (Engineering)
655 7\a Electronic books. \2 local
7102 \a ScienceDirect (Online service)
7761 \c Original \z 0125249853 \z 9780125249850 \w (DLC) 98016084 \w (OCoLC)38833054
85640\3 ScienceDirect \u http://www.sciencedirect.com/science/book/9780125249850 \z An electronic book accessible through the World Wide Web; click for information \y An electronic book accessible through the World Wide Web; click for information \y ScienceDirect
85642\3 Publisher description \u http://www.loc.gov/catdir/description/els033/98016084.html \y Publisher description
85641\3 Table of contents \u http://www.loc.gov/catdir/toc/els032/98016084.html \y Table of contents

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